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Depositordc.contributorBlair, Ewen O
Funderdc.contributor.otherEPSRC - Engineering and Physical Sciences Research Councilen_UK
Data Creatordc.creatorSmith, Stewart
Data Creatordc.creatorWalton, Anthony J
Data Creatordc.creatorBlair, Ewen O
Data Creatordc.creatorBuchoux, Anthony
Data Creatordc.creatorTsiamis, Andreas
Data Creatordc.creatorDunare, Camelia
Data Creatordc.creatorMarland, Jamie R K
Data Creatordc.creatorGray, Mark E
Data Creatordc.creatorTerry, Jonathan G
Date Accessioneddc.date.accessioned2019-10-25T13:22:19Z
Citationdc.identifier.citationSmith, Stewart; Walton, Anthony J; Blair, Ewen O; Buchoux, Anthony; Tsiamis, Andreas; Dunare, Camelia; Marland, Jamie R K; Gray, Mark E; Terry, Jonathan G. (2019). Test Structures for Developing Packaging for Implantable Sensors, [dataset]. University of Edinburgh. School of Engineering. Institute of Micro and Nanosystems.en
Persistent Identifierdc.identifier.urihttp://hdl.handle.net/10283/3434
Persistent Identifierdc.identifier.urihttps://doi.org/10.7488/ds/2638
Dataset Description (abstract)dc.description.abstractWith their capacity for real time monitoring and spatial mapping, implantable sensors are becoming an increasingly important aspect of next generation precision healthcare. Microfabricated sensor systems are a popular choice, owing to their capacity for miniaturisation, repeatable mass manufacture, and numerous pre-existing sensor archetypes. Despite the drive for development, packaging these sensors for the environment within the body, as well as the implantation process itself, presents a significant challenge. This paper presents microelectronic test structures, which can be used to assess, compare, and optimise implantable packaging solutions in a standardised manner. The proposed structures are used to investigate: (i) permeability of the insulation material, (ii) adhesion of the encapsulant to the die, (iii) capacity of the material to be patterned, and (iv) physical robustness of the package to implantation through a needle. They are used to characterise an example packaging strategy, using biocompatible epoxy-resin. In addition, a method of optimising the packaging performance using the test structures is presented.en_UK
Dataset Description (TOC)dc.description.tableofcontentsThis dataset contains data presented in the publication Test Structures for "Developing Packaging for Implantable Sensors". This dataset consists of 7 csv (comma separated variable) files. Figure 2.csv: This file contains reflectometer measurements of central silicon dioxide thickness before applying epoxy resin and packaging, as in figure 2 in the manuscript. Figure 4.csv: This file contains electrical resistance measurements of four pairs of wire bonds, each made on four test structures before applying epoxy resin, after packaging, and after 20 minutes of ultrasonication as in figure 4 in the manuscript. Figure 6 (a).csv: This file contains leakage current measurements from test structure 2 made over 7 different voltages (-5, -3, -1.5, 0, 1.5, 3, and 5 V), each applied for 5 minutes. The experiment was performed on three samples and is presented in figure 6 (a) in the manuscript. Figure 6 (b).csv: This file contains leakage current measurements from test structure 2 made over 7 different voltages (-5, -3, -1.5, 0, 1.5, 3, and 5 V), each applied for 5 minutes after 10 days of immersion in KCl solution. The experiment was performed on two samples and is presented in figure 6 (b) of the manuscript. Figure 7.csv: This file contains leakage current measurements from test structure 2 made over 7 different voltages (-5, -3, -1.5, 0, 1.5, 3, and 5 V), each applied for 5 minutes after 10 days of immersion in KCl solution. The experiment was performed on one samples and is presented in figure 7 of the manuscript. Figure 9.csv: This file contains leakage current measurements made over 4 electrodes on a test structure 3 over 10 days of immersion in KCl solution. The electrodes were held at 5 V at the current was sampled for 10 seconds from each one consecutively. The data is presented in figure 9 of the manuscript. Figure 12.csv: This file contains leakage current measurements made over 5 test structure 4s immersed in KCl solution, three of the test structures were subject to a thermal cure at 120C for 5 minutes and two were not. The electrodes were held at 5 V. The data is presented in figure 12 of the manuscript.en_UK
Languagedc.language.isoengen_UK
Publisherdc.publisherUniversity of Edinburgh. School of Engineering. Institute of Micro and Nanosystemsen_UK
Relation (Is Referenced By)dc.relation.isreferencedbyE.O. Blair, et. al. "Test Structures for Developing Packaging for Implantable Sensors," In preparation, 2019en_UK
Rightsdc.rightsCreative Commons Attribution 4.0 International Public Licenseen
Subjectdc.subjectMicrosystems packagingen_UK
Subjectdc.subjectImplantableen_UK
Subjectdc.subjectReliabilityen_UK
Subjectdc.subjectTest Structuresen_UK
Subjectdc.subjectSensorsen_UK
Subject Classificationdc.subject.classificationEngineering::Microelectronic Engineeringen_UK
Titledc.titleTest Structures for Developing Packaging for Implantable Sensorsen_UK
Typedc.typedataseten_UK
Embargo Datedc.date.embargo2020


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